迪艾斯半导体科技（上海）有限公司招聘Hardware Design Engineer

迪艾斯半导体科技（上海）有限公司 开始时间:2025-11-27 16:47:05 单位简介:
迪艾斯半导体科技是Technoporbe 的全资子公司，致力于成为半导体测试领域客户最信赖的硬件接口解决方案的合作伙伴。
迪艾斯半导体公司团队拥有超过20年的半导体测试行业经验的团队，涵盖硬件设计，开发，制造，测试，服务。公司在全球有超过600名员工，分布在全球9个国家和地区。

Technoprobe总部位于意大利，专注于半导体测试专用探针卡的设计、开发和生产，是全球SoC芯片测试用探针卡最大的供应商。连续五年被TechInsights 评为”Best Probe Card Supplier Worldwide”.

公司网址：ww***ech[点击查看]

相关信息: 学历要求:硕士,本科
Email for Apply: [email protected]




Job Title: Hardware Design Engineer

Location：Shanghai

Role Summary/Purpose

Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, solution evaluation, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology.

Job Description

· Provide global semiconductor interface test hardware solutions of next generation semiconductor devices for world-wide customers

· Provide chip test interface HW solution engineering to compare pros and cons of different approaches and recommend best option to customers considering both performance, lead time, cost

· Responsible for Testing circuits Design and super high layers PCB design for high complexity ATE device interface board correspond to various device testing, eg. Mobile application processor, High performance computer, AI, RF etc.

· Responsible for scheme selection of a SUBSTRATE/MLO design in wafer testing, research for low Cost of Test scheme (considering TDE, Skip DIE, substrate stack-up)

· Responsible for power integrity (PI) and signal integrity (SI) simulation at board level or system level, frequency domain or time domain to ensure HW product performance at design stage

· Implement complex mechanical design/simulation, cable design, thermal evaluation by collaborating with PCB design to achieve premium quality in hardware solution according to customer device testing ultimate challenges.

· Responsible for global end to end hardware project management to ensure best quality and on time delivery

ü Device testing requirement assessment and Feasibility study

ü Risk analysis and mitigation planning

ü Schedule planning and project management

ü Design execution

ü Regular review with global internal and external customers

ü Quality Control and Verification

· Work closely with Teradyne Global supply chain, provide solution to solve manufacture (DFM), assembly (DFA) challenges, ensure hardware products on time delivery and very high first pass rate

· New technology research, new products, new materials evaluation for next generation device testing

· Deliver hardware design training and seminars to customers

Requirements

· Master’s or Bachelor's degree in Electronic Engineering, Micro-Electronics, Mechatronics, Communication Engineering, Automation, Instrumentation and Measurement, Biomedical engineering, or similar major related to circuit design or hardware engineering

· Good knowledge and understanding of electronic circuit theory and application

· Good knowledge and experience in system level mechanical design, mechanical or thermal simulation and cable design.

· Knowledge and experience in multi-layer board design and embedded system design

· Knowledge in signal integrity or power integrity theory

· Familiar with one or more programming languages (C#, Python, VB, etc.)

· Good communication skills, good written and oral English

· Meticulous，pay attention to details

· Ability to effectively solve problems, open minded

· Ability to successfully work in a team, cross-functional environment